AURIX™ 32-bit microcontroller family

About this document

Scope and purpose

This Application note gives additional information to the TC3xx Data sheets for the listed devices regarding the

handling of the balls marked as NC and NC1.

  • TC336
  • TC356
  • TC366
  • TC337
  • TC357
  • TC367
  • TC377
  • TC387
  • TC397
  • TC389
  • TC399

In the Data sheet for the listed AURIX™ devices, the ‘no connect’ balls have been classified as:

  • NC - These pins are reserved for future extensions and shall not be connected externally.
  • NC1 - These pins are not connected on package level and will not be used for future extensions.

The general rule is that balls defined as NC or NC1 (Not Connected) must not be connected to any net including power supply or ground connections in the PCB routing. This rule is required because:

  • To ensure compatibility across the AURIX™ product platforms.
  • Because the connection of high-speed signals to NC balls may cause unwanted cross coupling effects in the BGA package interposer layer.
  • Some balls should not be connected for package soldering reliability reasons.

Introduction

For the TC3xx devices mentioned, static and dynamic analyses have been performed to allow the data sheet constraints to be relaxed such that some of the ‘no connect’ balls can be connected to PCB signals. This information has been provided to help to simplify common PCB designs for applications that wish to take advantage of the AURIX™ family platform approach.

The ball out for different variants has been shown and the NC and NC1 ball have been marked in different colors, depicting the routability of each of these balls. The color codes are as follows:



Attention: General layout precautions for example for critical signal routing, are the responsibility of the customer. Infineon take no liability for signal integrity on a system level.
Attention: This Application Note is primarily intended for hardware designers involved in PCB routing.

TC336 I/O ball configuration in the LFBGA180 package variant

TC336L and LP

Figure 1. TC336 L and LP I/O Configuration [1]


  • There are total of 15 NC balls.

TC336 DA

Figure 2. TC336DA I/O Configuration [2]


  • There are total of 19 NC balls.

TC356 I/O ball configuration in the LFBGA180 package variant

Figure 3. TC356 I/O Configuration [3]


  • There are total of 28 NC balls.

TC366 I/O ball configuration in the LFBGA180 package variant

Figure 4. TC366 I/O ball configuration [4]


  • There are total of 8 NC balls.

TC337 I/O ball configuration in the LFBGA292 package variant

TC377LP

Figure 5. TC337LP I/O ball configuration [1]


  • There are total of 68 NC balls and 3 NC1 balls.

TC337DA and DZ

Figure 6. TC337DA and DZ I/O ball configuration [2]


  • There are total of 49 NC balls and 3 NC1 balls.

TC357 I/O ball configuration in the LFBGA292 package variant

Figure 7. TC357 I/O ball configuration [3]


  • There are total of 35 NC balls and 3 NC1 balls.

TC367 I/O ball configuration in the LFBGA292 package variant

Figure 8. TC367 I/O ball configuration [4]


  • There are total of 34 NC balls and 3 NC1 balls.

TC377 I/O ball configuration in the LFBGA292 package variant

Figure 9. TC377 I/O ball configuration [5] [6]


  • There are total of 1 NC balls and 3 NC1 balls.
  • The Ballout is from TC377TP. This analysis is also valid for TC377TE and TC377TX

TC387 I/O ball configuration in the LFBGA292 package variant

Figure 10. TC387 I/O ball configuration [7]


  • There are total of 1 NC balls and 3 NC1 balls.

TC397 I/O ball configuration in the LFBGA292 package variant

Figure 11. TC397 I/O ball configuration [8]


  • There are total of 1 NC balls and 2 NC1 balls.

TC389 I/O ball configuration in the LFBGA516 package variant

Figure 12. TC389 I/O ball configuration [7]


  • There are total of 57 NC balls and 7 NC1 balls.

TC399 I/O ball configuration in the LFBGA292 package variant

Figure 13. TC399 I/O ball configuration [8]


  • There are total of 54 NC balls and 7 NC1 balls.

References

  1. Infineon Technologies AG, Datasheet TC33x_TC32x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  2. Infineon Technologies AG, Datasheet TC33xEXT 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  3. Infineon Technologies AG, Datasheet TC35x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  4. Infineon Technologies AG, Datasheet TC36x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  5. Infineon Technologies AG, Datasheet TC37x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  6. Infineon Technologies AG, Datasheet TC37xEXT 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  7. Infineon Technologies AG, Datasheet TC38x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
  8. Infineon Technologies AG, Datasheet TC39x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.

Revision history

Document versionDate of releaseDescription of changes
V1.02018-11First release
V1.12019-01Device TC356 added
V1.22021-04

Editorial Changes

  • Refurbished headings

Devices added

  • TC337LP
  • TC337DA and DZ
  • TC367
  • TC377
  • TC336L and LP
  • TC336DA
  • TC356 updated
  • TC366
V1.32024-03-08Template update; no content update.