AP32427 Connection of NC/NC1 Pins on AURIX TC3xx BGA packages
AURIX™ 32-bit microcontroller family
About this document
Scope and purpose
This Application note gives additional information to the TC3xx Data sheets for the listed devices regarding the
handling of the balls marked as NC and NC1.
- TC336
- TC356
- TC366
- TC337
- TC357
- TC367
- TC377
- TC387
- TC397
- TC389
- TC399
In the Data sheet for the listed AURIX™ devices, the ‘no connect’ balls have been classified as:
- NC - These pins are reserved for future extensions and shall not be connected externally.
- NC1 - These pins are not connected on package level and will not be used for future extensions.
The general rule is that balls defined as NC or NC1 (Not Connected) must not be connected to any net including power supply or ground connections in the PCB routing. This rule is required because:
- To ensure compatibility across the AURIX™ product platforms.
- Because the connection of high-speed signals to NC balls may cause unwanted cross coupling effects in the BGA package interposer layer.
- Some balls should not be connected for package soldering reliability reasons.
Introduction
For the TC3xx devices mentioned, static and dynamic analyses have been performed to allow the data sheet constraints to be relaxed such that some of the ‘no connect’ balls can be connected to PCB signals. This information has been provided to help to simplify common PCB designs for applications that wish to take advantage of the AURIX™ family platform approach.
The ball out for different variants has been shown and the NC and NC1 ball have been marked in different colors, depicting the routability of each of these balls. The color codes are as follows:
TC336 I/O ball configuration in the LFBGA180 package variant
TC356 I/O ball configuration in the LFBGA180 package variant

- There are total of 28 NC balls.
TC366 I/O ball configuration in the LFBGA180 package variant

- There are total of 8 NC balls.
TC337 I/O ball configuration in the LFBGA292 package variant
TC357 I/O ball configuration in the LFBGA292 package variant

- There are total of 35 NC balls and 3 NC1 balls.
TC367 I/O ball configuration in the LFBGA292 package variant

- There are total of 34 NC balls and 3 NC1 balls.
TC377 I/O ball configuration in the LFBGA292 package variant
TC387 I/O ball configuration in the LFBGA292 package variant

- There are total of 1 NC balls and 3 NC1 balls.
TC397 I/O ball configuration in the LFBGA292 package variant

- There are total of 1 NC balls and 2 NC1 balls.
TC389 I/O ball configuration in the LFBGA516 package variant

- There are total of 57 NC balls and 7 NC1 balls.
TC399 I/O ball configuration in the LFBGA292 package variant

- There are total of 54 NC balls and 7 NC1 balls.
References
- Infineon Technologies AG, Datasheet TC33x_TC32x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC33xEXT 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC35x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC36x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC37x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC37xEXT 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC38x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
- Infineon Technologies AG, Datasheet TC39x 32-bit single chip microcontroller, Munich: Infineon Technologies AG.
Revision history
Document version | Date of release | Description of changes |
---|---|---|
V1.0 | 2018-11 | First release |
V1.1 | 2019-01 | Device TC356 added |
V1.2 | 2021-04 | Editorial Changes
Devices added
|
V1.3 | 2024-03-08 | Template update; no content update. |