AP32541 AURIX TC3xx Motor Control Power Board
TriCore™, TC3xx Family, AURIX™ 32-bit microcontrollers
About this document
Scope and purpose
This application note provides an overview of the 3-phase motor control power board including its main features, key data, pin assignments and mechanical dimensions.
The power board has been designed to operate in various configurations and conditions, such as input voltages and control algorithms.
The hardware is compatible with AURIX™ Application Kit TC3x7 with TFT display, with AURIX™ TC3x7 in LFBGA-292 package.
Attention: This power board is intended only for evaluation purposes and is not intended to be an end product. Please always take care of the dead-time settings of the gate driver and always have in mind that power board has no breaking chopper or similar hardware protection to absorb the energy generated during regenerative breaking of a motor. In any case, user should ensure that voltage and current are monitored properly, by software or additional hardware.
The design of this board originates from the need of a simple and plug-and-play motor drive power board to be used for AURIX™ TC3xx evaluation purposes in motor drive applications.
Intended audience
This document is intended for all technical specialists working with the motor control power board under laboratory conditions.
Introduction
The motor control power board is a part of the KIT_A2G_TC387_MOTORCTR package (eMotor Kit). In order to run a motor, the matching control board is required to interface this power board. The motor control power board is compatible with AURIX™ Application Kit TC3x7 with TFT display, with AURIX™ TC3x7 in LFBGA-292 package [1].
The motor control power board is equipped with all assembly circuits required for sensor based and sensorless based field oriented control (FOC), as well for the block commutation control. It provides low voltage DC connector, three phase output for connecting the motor, and connectors for position sensors such as encoder, resolver and Hall.
An encoder sensor based FOC application example is described in [2]. In this example, three shunts in the ground path are used for phase currents sensing. The DC-link voltage sensing, phase voltage sensing and high-side DC-link current sensing information could be used for monitoring purposes.
As a part of KIT_A2G_TC387_MOTORCTR the motor control power board is available through regular Infineon distribution partners as well as on Infineon's website.
Key features
The motor control power board characteristics are:
- All components are SMD and only placed on the top side
- Driving of a three phase PMSM / BLDC (12 V, max. 50 W)
- Sensing of motor position with resolver, encoder or Hall sensors
- Advanced gate driver (TLE9180D-31QK)
- High-side DC-link current sensing
- Low-side DC-link current sensing
- Phase current sensing with two or three shunts in ground path
- Sensing of DC-link voltage
- Sensing of phase voltages
- Configuration / Diagnostic via SPI (TLE9180D-31QK)
- Power board fits perfectly to Application Kit TC3xx with TFT display, with AURIX™ TC3x7 in LFBGA-292 package
- Low power status LED
- PCB dimensions: 100mm x 120mm
- All test points accessible from bottom side
Block diagram
The block diagram of low voltage motor control power board is shown in Figure 1. This power board includes low power DC connector, control board connectors, low power motor connectors, resolver connector, encoder connector and Hall sensor connector. The auxiliary power supply TLE42744DVD50 is used to provide 5V for an advanced gate driver TLE9180D-31QK and motor positon sensor interfaces. The LED indicates the presence of the generated 5V voltage. The phase current sensing is possible with two or three shunts in the ground path. The low-side DC-link current sensing could be used with slight changes. The TLE9180D-31QK has three integrated current sense amplifiers with programmable gains. The high-side DC-link current sensing is implemented by using a bidirectional, zero-drift, high-speed current-shunt monitor. The DC-link voltage and phase voltage sensing are directly measured using resistive dividers with RC filters and the mounting options for Zener diodes which can be used to protect microcontroller pins. The 3-phase Power Bridge consists of three IPG20N04S4-08A dual N-channel MOSFETs.
Figure 1. Block diagram of low voltage AURIX™ Motor Control Power Board in connection with AURIX™ TC3xx Application Kit with TFT display
Placement
The top and the bottom component and test points’ placement are shown in Figure 2 and Figure 3, respectively.
Figure 1. Block diagram of low voltage AURIX™ Motor Control Power Board in connection with AURIX™ TC3xx Application Kit with TFT display
Figure 3. Bottom placement, test points
The mappings between test points and signal names are provided in Table 6, Table 8, Table 10 and Table 11.
Connector Pin Assignment
Control board connectors
General information about the connectors used for connection of control board and the power board is described below. For more details about control board pinout check [1].
Figure 4 shows the control board connectors’ pinout, BU6 and BU7 (placement shown on Figure 2).
Figure 4. Control board connectors - Pinout
Table 1 provides the pin assignments of the BU6.
Short name | Description | Pin number |
---|---|---|
VCC_IN | Supply Input of Application Kit with TFT display ( 5.5 V÷50 V) | 1 |
VEXTA | Not connected | 2 |
GND | Ground | 3 |
GND | Ground | 4 |
SIN- | Analog signal / Trimmed resolver sensing coil SIN- signal (VCC/2) | 5 |
SIN+ | Analog signal / Trimmed resolver sensing coil SIN+ signal | 6 |
BEMF_U | Analog input / Phase voltage U sensing signal | 7 |
VOLT_DC | Analog signal /DC-Link voltage sensing signal | 8 |
COS- | Analog signal / Trimmed resolver sensing coil COS- signal (VCC/2) | 9 |
COS+ | Analog signal / Trimmed resolver sensing coil COS+ signal | 10 |
VRO | Analog signal / Reference voltage, used for current sensing | 11 |
VO1 | Analog signal / Phase current 1 (U or low side DC-link current) | 12 |
PFB1 | Digital signal / Phase voltage feedback 1 (U) | 13 |
GS1_HS | Digital signal / Gain select, high side DC-link current sense | 14 |
GS0_HS | Digital signal / Gain select, high-side DC-link current sense | 16 |
PFB1_Enable | Digital signal / Enable PFB1 monitoring | 17 |
PFB2 | TLE9180D-31QK – Digital signal / Phase voltage feedback 1 (V) | 18 |
PFB3 | TLE9180D-31QK – Digital signal / Phase voltage feedback 1 (W) | 20 |
/ENA | TLE9180D-31QK – Enable | 26 |
MOSI | TLE9180D-31QK – SPI Master In Slave In | 27 |
MISO | TLE9180D-31QK – SPI Master In Slave Out | 28 |
CSN | TLE9180D-31QK – SPI Chip Select Not | 29 |
CLK_SPI | TLE9180D-31QK – SPI Clock Serial Peripheral Interface | 30 |
/ERR | TLE9180D-31QK – Error not | 31 |
/SOFF | TLE9180D-31QK – Independent save state | 38 |
Table 2 provides the pin assignments of the BU7.
Short name | Description | Pin number |
---|---|---|
VCC_IN | Supply input of Application Kit with TFT display ( 5,5V...50V) | 1 |
VEXTB | Not connected | 2 |
GND | Ground | 3 |
GND | Ground | 4 |
/INH | TLE9180D-31QK – Inhibit not (active low) | 10 |
CGPWM_N | Resolver exciting coil signal, negative | 13 |
CGPWM_P | Resolver exciting coil signal, positive | 14 |
HALL A | Hall A signal | 16 |
HALL B | Hall B signal | 17 |
HALL C | Hall C signal | 18 |
ENC_A | Encoder A signal | 19 |
ENC_B | Encoder B signal | 20 |
ENC_C | Encoder top zero signal | 21 |
IL1 | PWM Low side 1 | 24 |
/IH1 | PWM High side 1 | 25 |
IL2 | PWM Low side 2 | 26 |
/IH2 | PWM High side 2 | 27 |
IL3 | PWM Low side 3 | 28 |
/IH3 | PWM High side 3 | 29 |
BEMF_V | Analog input / Phase voltage V sensing signal | 35 |
IDC_HS | Analog input / High-side DC-link current sensing signal | 36 |
VO3 | Analog input / Phase current 3 (W) | 38 |
BEMF_W | Analog input / Phase voltage W sensing signal | 39 |
VO2 | Analog input / Phase current 2 (V) | 40 |
Resolver connector
Figure 5 shows the resolver signals connector pinout, X1 (placement shown on Figure 2).
Figure 5. Resolver connector
Table 3 provides the pin assignments of the resolver connector, X1.
Short name | Description | Pin number |
---|---|---|
S1 | Resolver sensing coil SIN+ signal | 1 |
S2 | Resolver sensing coil SIN- signal | 2 |
S3 | Resolver sensing coil COS+ signal | 3 |
S4 | Resolver sensing coil COS- signal | 4 |
S5 | Resolver exciting coil signal, positive | 5 |
S6 | Resolver exciting coil signal, negative | 6 |
Hall signals connector
Figure 6 shows the Hall signals connector pinout, X2 (placement shown on Figure 2).
Figure 6. Hall signals connector
Table 4 provides the pin assignments of the resolver connector, X2.
Short name | Description | Pin number |
---|---|---|
5V | Supply of Hall sensor | 1 |
HALLA | Hall sensor A signal | 2 |
HALLB | Hall sensor B signal | 3 |
HALLC | Hall sensor C signal | 4 |
N.C | Not connected | 5 |
GND | Ground | 6 |
Encoder connector
Figure 7 shows the encoder signals connector pinout, X3 (placement shown on Figure 2).
Figure 7. Encoder connector
Table 5 provides the pin assignments of the resolver connector, X3.
Short name | Description | Pin number |
---|---|---|
N.C. | Not connected | 1 |
+5V | Supply of encoder | 2 |
GND | Ground | 3 |
N.C. | Not connected | 4 |
ENC_CH_AN | Neg. Incremental Signal Channel A | 5 |
ENC_CH_A | Incremental Signal Channel A | 6 |
ENC_CH_BN | Neg. Incremental Signal Channel B | 7 |
ENC_CH_B | Incremental Signal Channel B | 8 |
ENC_CH_ZN | Neg. Incremental Signal Channel Z (top 0) | 9 |
ENC_CH_Z | Incremental Signal Channel Z (top 0) | 10 |
Schematic and Layout
Overview
An overview of the board’s schematics is shown in Figure 8. Basically, the schematic can be divided into five sub-blocks:
- the advanced gate driver and supply (shown in Figure 9)
- the power stage with current and voltage sensing’s (shown in Figure 10)
- resolver interface (shown in Figure 12)
- encoder and hall sensors interface (shown in Figure 14)
- control board connectors (shown in Figure 15)
The external controller board (AURIX™ Application Kit TC3xx with TFT display) has to be connected to the evaluation board by the BU6 and BU7 power board connectors.
Figure 8. Schematic: Overview

Power supply and three phase gate driver
Figure 9 depicts the schematic of the power supply and three phase gate driver (U_TLE9180_Supply block in Figure 8).
The power board must be supplied by an external DC power supply (from 12 V to 24 V) connected to its power connectors (BU4 and BU5). The power to be delivered by the external power supply depends on the overall load mainly defined by the power consumption of the motor. The power supply unit (12 V / 2 A) delivered with the motor control kit is sufficient to supply the control board and the motor provided with the kit.
Figure 9. Schematic: Power supply and three phase gate driver

Table 6 provides the list of test points and related signals. Test points placement is of shown on Figure 3.
Test point | Signal |
---|---|
TP3 | +5 V |
TP4 | VRO, for details see Table 7 |
TP5 | VO1, for details see Table 7 |
TP6 | VO2, for details see Table 7 |
TP7 | VO3, for details see Table 7 |
TP20 | IL1, for details see Table 7 |
TP21 | /IH1, for details see Table 7 |
TP22 | IL2, for details see Table 7 |
TP23 | /IH2, for details see Table 7 |
TP24 | IL3, for details see Table 7 |
TP25 | /IH3, for details see Table 7 |
Power supply
The 3-phase Bridge Driver IC needs 2 different supply voltages. The 12 V is supplied externally. The 5 V are generated internally via the Infineon TLE 42744D V50. The LED indicates the presence of the generated 5 V voltage. Additionally, TLE 42744D V50 provides 5 V for position sensor circuits, as shown in Figure 9.
The TLE42744 is a monolithic integrated low dropout voltage regulator for load currents up to 400 mA. An input voltage up to 40 V is regulated to VQ,nom = 5 V / 3.3 V with a precision of ±2%. The device is designed for the harsh environment of automotive applications. Therefore, it is protected against overload, short circuit, and over-temperature conditions by the implemented output current limitation and the over-temperature shutdown circuit. The TLE42744 can also be used in other applications requiring a stabilized 5 V / 3.3 V voltage. Due to its very low quiescent current, the TLE42744 is dedicated for use in applications where power is permanently connected to VBAT.
The power board has to be connected to an external 12 V DC power supply by using BU4 (12 V) and BU5 (GND), as shown in Figure 2.
The maximum power consumption is not specified, but the current should not exceed 3 A.
Three phase gate driver
The TLE9180D-31QK, shown in Figure 9, is an advanced gate driver IC dedicated to control 6 external N-channel MOSFETs forming an inverter for high current 3-phase motor drive applications in the automotive sector.
An advanced high voltage technology allows the TLE9180D-31QK to support applications for single and mixed battery systems with battery voltages of 12 V, 24 V, and 48 V even within tough automotive environments in combination with high motor currents. Therefore, bridge, motor, and supply-related pins can withstand voltages of up to 90 V. Motor-related pins can even withstand negative voltage transients down to -7 V up to -15 V without destruction.
An integrated SPI interface is used to configure the TLE9180D-31QK for the application after power-up. After successful power-up, adjusting parameters, monitoring data, configuration and error registers can be read through SPI interface. Cyclic redundancy check over data and address bits ensures safe communication and data integrity.
Ground related bridge currents can be measured with up to 3 integrated current sense amplifiers. The outputs of the current sense amplifiers support 5 V ADCs and the robust inputs can withstand negative transients down to -10 V without destruction. Low noise, fast settling times and high accuracy are the main features of the integrated current sense amplifiers. Gain and the zero current voltage offset can be adjusted by reconfigurations through SPI. The offset can be calibrated.
Diagnostic coverage and redundancy have increased steadily in recent years in automotive drive applications. Therefore the TLE9180D-31QK offers a wide range of diagnostic features, such as monitoring of power supply voltages and system parameters. A testability of safety relevant supervision functions has been integrated. The failure behavior, the threshold voltages and the filter times of the supervisions of the device are adjustable by using SPI.
The TLE9180D-31QK is integrated in a
- VQFN48 7*7 package with an exposed pad
- LQFP64 package with an exposed pad
Due to its exposed pad the gate driver IC provides an excellent thermal characteristic.
Table 7 provides an overview of TLE9180D-31QK used pins in motor control power board. For more information about pin functionalities and expected signals, see [4] .
Short name | Description |
---|---|
/ERR | Error signal (active low) |
/IH1 | Input for high-side switch 1 (active low) |
IL1 | Input for low-side switch 1 (active high) |
IL2 | Input for low-side switch 2 (active high) |
/IH2 | Input for high-side switch 2(active low) |
/IH3 | Input for high-side switch 3 (active low) |
IL3 | Input for low-side switch 3 (active high) |
MISO | SPI Master In, Slave Out |
MOSI | SPI Master Out, Slave In |
CSN | SPI Chip Select |
CLK_SPI | SPI clock input |
VCC | Power supply for digital I/O pins and input for VCC monitoring |
/SOFF | Independent safe state switch off (active low) |
VDH | Connection to drain of high-side switches for short circuit detection; Supply for CP2 |
CH2 | + Terminal for pump capacitor of charge pump 2 |
CL2 | - Terminal for pump capacitor of charge pump 2 |
/INH | Inhibit pin (active low) |
VS | Voltage supply |
CH1 | + Terminal for pump capacitor of charge pump 1 |
CL1 | - Terminal for pump capacitor of charge pump 1 |
CP_GND | Charge pump GND |
CB | Buffer capacitor for charge pump 1 |
GL1 | Output to gate low-side switch 1 |
SL1 | Connection to source low-side switch 1 |
BH1 | Bootstrap pin for + terminal of bootstrap capacitor CBS1 |
SH1 | Connection to source high-side switch 1 |
GH1 | Output to gate high-side switch 1 |
SL2 | Connection to source low-side switch 2 |
GL2 | Output to gate low-side switch 2 |
BH2 | Bootstrap pin for + terminal of bootstrap capacitor CBS2 |
SH2 | Connection to source high-side switch 2 |
GH2 | Output to gate high-side switch 2 |
BH3 | Bootstrap pin for + terminal of bootstrap capacitor CBS3 |
SH3 | Connection to source high-side switch 3 |
GH3 | Output to gate high-side switch 3 |
SL3 | Connection to source low-side switch 3 |
GL3 | Output to gate low-side switch 3 |
GND | GND |
PFB3 | Phase feedback of motor connection phase 3 |
PFB2 | Phase feedback of motor connection phase 2 |
PFB1 | Phase feedback of motor connection phase 1 |
VRO | Output of reference voltage of differential amplifier |
VO3 | Output of differential 3 amplifier for shunt signal amplification |
VO2 | Output of differential 2 amplifier for shunt signal amplification |
VO1 | Output of differential 1 amplifier for shunt signal amplification |
ISP | + Input of differential amplifier for shunt signal amplification |
ISN | - Input of differential amplifier for shunt signal amplification |
AGND | Analog ground especially for the current sense differential amplifier |
ENA | Enable pin (active high) |
Power Bridge, current and voltage sensing
Figure 10 depicts the schematic of the Power Bridge, current and voltage sensing (U_B6 block in Figure 8).
Figure 10. Schematic: Power Bridge, current and voltage sensing
Table 8 provides the list of test points and related signals of schematic shown on Figure 10. Test points placement is of shown on Figure 3.
Test point | Signal |
---|---|
TP14 | GH1, for details see Table 7 |
TP15 | GL1, for details see Table 7 |
TP16 | GH2, for details see Table 7 |
TP17 | GL2, for details see Table 7 |
TP18 | GH3, for details see Table 7 |
TP19 | GL3, for details see Table 7 |
TP28 | INA225AIDGK IN+, connected to supply side of high-side DC-link shunt resistor |
TP29 | INA225AIDGK IN-, connected to load side of high-side DC-link shunt resistor |
TP30 | IDC_HS, for details see High-side DC-link current sensing |
TP31 | VOLT_DC, for details see DC-link voltage sensing |
TP32 | SH1, for details see Table 7 |
TP33 | SL1, for details see Table 7 |
TP34 | ISP1, for details see Table 7 |
TP35 | ISN1, for details see Table 7 |
TP36 | BEMF_U, for details see Phase voltages sensing |
TP37 | SH2, for details see Table 7 |
TP38 | SL2, for details see Table 7 |
TP39 | ISP2, for details see Table 7 |
TP40 | ISN2, for details see Table 7 |
TP41 | BEMF_V, for details see Phase voltages sensing |
TP42 | SH3, for details see Table 7 |
TP43 | SL3, for details see Table 7 |
TP44 | ISP3, for details see Table 7 |
TP45 | ISN3, for details see Table 7 |
TP46 | BEMF_W, for details see Phase voltages sensing |
Power Bridge
For the Power Bridge, three dual N-channel MOSFETs IPG20N04S4-08A in a smart PG-TDSON-8-10 package have been selected, as shown in Figure 10.
Summary of features:
- Dual N-channel Normal Level - Enhancement mode
- AEC Q101 qualified
- MSL1 up to 260°C peak reflow
- 175°C operating temperature
- Green Product (RoHS compliant)
- 100% Avalanche tested
- Feasible for automatic optical inspection (AOI)
Benefits:
- Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction
- Bond wire is 200 µm for up to 20 A current
- Larger source lead frame connection for wire bonding
- Same thermal and electrical performance as a DPAK with the same die size
- Exposed pad provides excellent thermal transfer (varies with die size)
- Two N-Channel MOSFETs in one package with 2 isolated lead frames
DC-link voltage sensing
The DC-link voltage is directly measured using resistive divider at the power board low power supply connection, as shown in Figure 10. The DC-link voltage signal is available at VOLT_DC pin of the control board signal connector BU6, as shown in Figure 4. The DC-link voltage signal could be used in motor control software for over and under voltage protection or for the compensation of the DC-Link voltage in the motor control loop.
A free soldering pad for a 5.1 V Zener diode is available and pin voltage can be clamped to protect the microcontroller pin. Consider that the Zener diode might have considerable capacitive behavior.
High-side DC-link current sensing
The voltage across the high-side DC-link shunt resistor is fed into the INA225AIDGK inputs IN- and IN+, as shown in Figure 10. The INA225AIDGK, bidirectional current-shunt monitor, has programmable gain levels [6]. The high-side DC-link current sensing signal is available at IDC_HS pin of the control board signal connector BU7, while the gain selection pins GS0 and GS1 are available at control board signal connector BU7, as shown in Figure 4. The DC-link current sensing could be used in motor control software for monitoring, three phase current reconstruction or other purposes.
Table 9 provides the gain select settings based on voltage levels applied to GS0 and GS1.
Gain | GS0 | GS1 |
---|---|---|
25 V/V | GND | GND |
50 V/V | GND | VS |
100 V/V | VS | GND |
200 V/V | VS | VS |
Shunt resistor is selected to be 10 mΩ ±1%, 3W.
Three phase and low-side DC-link current sensing
The motor control power board is designed based on three phase current sensing, while for low-side DC-link current sensing it needs hardware changes. The voltage across the three phase shunt resistors is fed into the TLE9180D-31QK shunt positive and negative inputs (ISPx and ISNx, where x = 1, 2, 3), as shown in Figure 10. The TLE9180D-31QK has 3 integrated current sense amplifiers (CSA). The outputs of the current sense amplifiers feed ADCs with an analog range from 0 V to 5 V. The offsets and gains of current sense amplifiers are programmable by using SPI [4]. Following gains of current sense amplifiers are possible:
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The DC output voltage at the outputs of the CSAs (VOx, x = 1, 2, 3) for zero differential input voltage is defined by the output of the reference buffer at Voltage Reference Output (VRO) pin. Therefore, positive and negative currents through the shunt resistor can be amplified by the CSAs and thus measured by the ADC of microcontroller. Three different VRO voltages can be set at the reference buffer RB. Each of the three VRO voltage settings can be fine-tuned.
VRO output voltage levels:
- 0.5 V
- 1.65 V
- 2.5 V
Additionally, VRO output voltage level can be trimmed, see [4].
Shunt resistors are selected to be 10 mΩ ±1%, 3 W.
In case of using the low-side DC-link current sensing, following guideline shall be followed:
- Remove the 10 mΩ resistors R17, R27 and R37
- Assemble R17, R27 and R37 resistors with 0 Ω resistors
- Remove R6 resistor
- Assemble R7 with 10 mΩ ±1%, 3 W resistor
- Remove R119 and R120 resistors
Phase voltages sensing
The phase voltage is directly measured using resistive dividers at the phases, as shown in Figure 10. The phase voltage sensing signals are available at BEMF_U, BEMF_V, BEMF_W pins of the control board signal connectors BU6 and BU7, as shown in Figure 4.
Phase voltage sensing is available for sensorless BLDC scalar control using 6-step modulation scheme as well as for various other scopes.
A free soldering pad for a 5.1 V Zener diode is available and pin voltage can be clamped to protect the microcontroller pin. Consider that the Zener diode might have considerable capacitive behavior.
Resolver interface
Resolvers are absolute angle transducers that are mounted on the motor shaft to get the motor’s absolute angular position. Resolvers are often used for angle sensing in noisy environments, due to their rugged construction and their ability to reject common-mode noise. Resolver applications, shown on Figure 11, determine the rotation angle by evaluating the induced signals from two orthogonally placed coils, SIN and COS. These coils are excited by the magnetic field of a third coil. Their amplitudes are modulated with the sine and cosine magnitudes corresponding to the current resolver position.
Figure 11. Resolver application
Figure 12 shows the schematic of the resolver interface that provides sinusoidal resolver excitation and adapts the sine and cosine signals to fit AURIX™ Enhanced Delta-Sigma to Digital Converter (EDSADC) module input voltage range (U_Resolver block in Figure 8).
Figure 12. Schematic: Resolver interface
Table 10 provides the list of test points and related signals of schematic shown on Figure 12. Test points placement is of shown on Figure 3.
Test point | Signal |
---|---|
TP1 | SIN+, for details see Table 1 |
TP2 | COS+, for details see Table 1 |
TP26 | SIN-, for details see Table 1 |
TP27 | COS-, for details see Table 1 |
TP47 | CGPWM_N, for details see Table 2 |
TP48 | CGPWM_P, for details see Table 2 |
TP49 | S1, for details see Table 3 |
TP50 | S2, for details see Table 3 |
TP51 | S3, for details see Table 3 |
TP52 | S4, for details see Table 3 |
TP53 | S5, for details see Table 3 |
TP54 | S6, for details see Table 3 |
Resolver sine excitation signal (carrier), generated within EDSADC module, is provided as a differential signal on AURIX™ device pins CGPWMp and CGPWMn [3]. The carrier signal is first filtered by means of RC stage (Fcp for signal CGPWMp and Fcn for signal CGPWMn) and then amplified by means of inverting amplifier (U4A for signal CGPWMp with Ratiop and Offsetp, while U4B for signal CGPWMn with Ration and Offsetn) – to tune the signals with respect to gain and offset. To reach required power ratings needed for excitation of typical resolver external amplification circuit, implemented as a push-pull stage (bipolar transistor Q4/Q5 for S5 and Q6/Q7 for S6), is provided to increase resolver excitation circuit current driving capabilities – in this design up to 1A can be driven. The diodes D3/D4 and D5/D6 set the quiescent current in the output stage Q4/Q5 and Q6/Q7, respectively. The resistors R52/R56 and R62/R66 set the quiescent current in the intermediate buffer stage at output of the operation amplifiers U4A and U4B. The maximum out current is set by resistors R54/R55 and R64/R65 for the CGPWMp and CGPWMn, respectively.
The sine and cosine signals from resolver are trimmed with 4-channel operational amplifier (U3) to fit within EDSADC range of AURIX™ TC3xx device. The channels U3A and U3D are used to define common mode voltages (Offsetcos- ,Offsetsin-) for resolver negative sine and cosine coils signals. The channels U3B and U3C are the scaled down filtered signals Fcsin+,Fccos+) of resolver positive sine and cosine coils signals.
Encoder and Hall sensor interface
An incremental encoder contains LED emitters, integrated circuits with light detectors and output circuitry. A disk with a markings pattern on its surface rotates between the emitter and detector IC, thus allowing and blocking the light of the emitter from reaching the detector IC. The outputs of the detector IC could be single-ended and differential signals. There are three output signals. Two of them provide a square wave signal with a 90 degree phase shift. The third one generates once per revolution a short pulse for synchronization.
Figure 13. Encoder application
Figure 14 shows the schematic of the encoder and Hall sensor interface (U_Hall_Encoder block in Figure 8).
Figure 14. Schematic: Encoder and Hall sensors interface
Table 11 provides the list of test points and related signals of schematic shown on Figure 14. Test points placement is of shown on Figure 3.
Test point | Signal |
---|---|
TP8 | ENC_A, for details see Table 2 |
TP9 | ENC_B, for details see Table 2 |
TP10 | ENC_C, for details see Table 2 |
TP11 | HALL_C, for details see Table 2 |
TP12 | HALL_B, for details see Table 2 |
TP13 | HALL_A, for details see Table 2 |
The encoder interface connector provides a differential input which is transformed into single ended signals by an interface IC as the microcontroller needs single ended signals. The differential signals from the encoder (ENCA +/-, ENCB +/-, ENCZ +/-) must be connected to the 10-pin encoder connector X4 (Figure 7).
In case of using a Hall sensor the signals must be attached to the connector X2 (Figure 6). Next to the Hall signals that are pulled up to 5 V, the 5 V Hall sensor supply and GND connections are also available.
Control board connectors
Figure 15 shows the control board connectors. The power board is compatible with AURIX™ Application Kit TC3xx with TFT display (U_Connectors block in Figure 8).
Figure 15. Schematic: Control board connectors

Following tables shows used pins of control board AURIX™ Application Kit TC387 with TFT display. The power board connector BU6 will be connected with the X102 connector of AURIX™ Application Kit TC387 with TFT display, while BU7 with X103. The pin numbering matches (e.g. BU6 Pin 1 == X102 Pin 1, BU7 Pin1 == X103 Pin 1).
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
AN0 | T10 | Analog input | V01 |
AN24/P40.0 | W2 | Analog input | V02 |
AN16 | W5 | Analog input | V03 |
AN8 | W8 | Analog input | VR0 |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
AN20 | Y3 | Analog input | SIN+ |
AN21 | Y2 | Analog input | SIN- |
AN2 | W9 | Analog input | COS+ |
AN3 | U9 | Analog input | COS- |
P02.0 | B1 | Output | CGPWMN |
P02.1 | C2 | Output | CGPWMP |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
AN13 | W6 | Analog input | BEMF_U |
AN19/P40.12 | W3 | Analog input | BEMF_V |
AN25/P40.1 | W1 | Analog input | BEMF_W |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
AN18/P40.11 | W4 | Analog input | IDC_HS |
AN11 | W7 | Analog input | VOLT_DC |
P33.2 | W11 | Output | GS0_HS |
P33.4 | W12 | Output | GS1_HS |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
P33.5 | Y12 | Input | PFB1 |
P33.6 | W13 | Input | PFB2 |
P33.12 | W16 | Input | PFB3 |
P33.10 | W15 | Output | /SOFF |
P33.11 | Y15 | Output | ENA |
P20.0 | H20 | Output | /INH |
P15.2 | C19 | Input | /ERR |
P33.1 | Y10 | Output | PFB1_ENABLE |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
P22.0 | P20 | Output | MOSI |
P22.1 | P19 | Input | MISO |
P22.2 | R20 | Output | CSN |
P22.3 | R19 | Output | CLK_SPI |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
P00.2 | H1 | Output | IL1 |
P00.3 | H2 | Output | /IH1 |
P00.4 | J1 | Output | IL2 |
P00.5 | J2 | Output | /IH2 |
P00.6 | J4 | Output | IL3 |
P00.7 | K1 | Output | /IH3 |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
P02.6 | E1 | Input | ENC_A |
P02.7 | F2 | Input | ENC_B |
P02.8 | F1 | Input | ENC_C |
AURIX™ TC387 Name | AURIX™ TC387 Pin | AURIX™ TC387 Direction | Signal of power board |
---|---|---|---|
P02.3 | D2 | Input | HALL_A |
P02.4 | D1 | Input | HALL_B |
P02.5 | E2 | Input | HALL_C |
PCB Layout
The layout of this board is especially designed for evaluation purposes. Consequently, it has test points and is not necessarily suited for continuous operation at full load. The PCB has four electrical layers with 70 µm copper. The size is 100 mm x 120 mm. The PCB thickness is 1.6 mm. For more details on the layout design and the latest Gerber-files, contact our technical support team.
Figure 16 illustrates the top assembly print of the power board.
Figure 16. Top overlay print of the power board

Figure 17 illustrates the bottom assembly print of the power board.
Figure 17. Bottom overlay print of the power board

Figure 18 illustrates the dimensions of the PCB.
Figure 18. Dimensions of the power board

The top layer routing of the PCB is provided in Figure 19.
Figure 19. Top layer routing of the power board

Figure 20 illustrates the bottom layer routing of the PCB.
Figure 20. Bottom layer routing of the power board

Bill of Materials
Table 21 provides the complete bill of materials of the motor control power board.
No. | Qty | Part description | Designator |
---|---|---|---|
1 | 2 | Multicomp PCB Socket A-2.107-B (black) | BU1, BU5 |
2 | 2 | Multicomp PCB Socket A-2.107-R (red) | BU2, BU4 |
3 | 1 | Multicomp PCB Socket A-2.107-Y (yellow) | BU3 |
4 | 1 | Capacitor SMD; 4µ7/35V; FROLYT – 4 | C1 |
5 | 1 | Capacitor SMD min. 6,3V; ESR < 3R; 22µF; 1206 | C2 |
6 | 7 | Capacitor SMD; 2,2µF; 603 | C3, C4, C5, C6, C11, C21, C31 |
7 | 20 | Capacitor SMD; 100p; 603 | C7, C8, C9, C17, C18, C27, C28, C37, C38, C40, C41, C44, C45, C46, C47, C48, C49, C51, C55, C56 |
8 | 6 | Capacitor SMD; 1 nF (not mounted); 603 | C10, C14, C20, C24, C30, C34 |
9 | 3 | Capacitor 1000 µF/35 V RS108-35V-RL13x14 71; RAD5-13 | C12, C22, C32 |
10 | 6 | Capacitor SMD; 4,7 nF; 603 | C13, C15, C23, C25, C33, C35 |
11 | 3 | Capacitor SMD; 1,5 nF; 603 | C16, C26, C36 |
12 | 3 | Capacitor SMD; 330 nF; 603 | C19, C29, C39 |
13 | 2 | Capacitor SMD; 470 pF; 603 | C42, C43 |
14 | 1 | Capacitor SMD; 100 nF; 603 | C50 |
15 | 9 | Capacitor SMD, Resistor SMD; (not mounted); 603 | C52, C53, C54, C57, C58, C59, C60, R8, R9 |
16 | 6 | Capacitor SMD; 100 nF; 603 | CB1, CB2, CB3, CB4, CB5, CB6 |
17 | 1 | Schottky Diode SMD; SS26; DO214-AA | D1 |
18 | 1 | LED PLCC2 2mA green; LP T67K; LED-TOP | D2 |
19 | 4 | Schottky Diode SMD; BAS52-02V; SC79 | D3, D4, D5, D6 |
20 | 4 | Zehner MM3Z5V1ST1G; (not mounted); SOD323 | D7, D8, D9, D10 |
21 | 3 | OptiMOS-T2 Power Transistor; IPG20N04S4-08A; TDSON-8-10 | Q1, Q2, Q3 |
22 | 2 | NPN Transistor SMD; MMBT4401LT1G; SOT23 | Q4, Q6 |
23 | 2 | PNP Transistor SMD; MMBT4403LT1G; SOT23 | Q5, Q7 |
24 | 1 | Resistor SMD; RC2512JK-071; 1R; 2512 | R1 |
25 | 1 | Resistor SMD; 1K5; 603 | R2 |
26 | 27 | Resistor SMD; 0R; 603 | R3, R42, R43, R103, R104, R105, R108, R109, R119, R120, R125, R126, R127, R128, R129, R130, R131, R132, R133, R134, R135, R136, R137, R138, R139, R140, R141 |
27 | 31 | Resistor SMD, Resistor SMD 0.1%; 1K; 603 | R5, R40, R41, R70, R71, R72, R73, R74, R75, R76, R77, R78, R79, R80, R81, R82, R83, R84, R85, R86, R87, R88, R93, R94, R95, R96, R97, R98, R99, R106, R107 |
28 | 1 | Resistor SMD; RC2512JK-070; 0R/10A; 2512 | R6 |
29 | 1 | Resistor; (not mounted) WSL3637 | R7 |
30 | 6 | Resistor SMD; 47R; 603 | R10, R12, R20, R22, R30, R32 |
31 | 6 | Resistor SMD; 100K; 603 | R11, R14, R21, R24, R31, R34 |
32 | 6 | Resistor SMD; 2,2R; 603 | R13, R15, R23, R25, R33, R35 |
33 | 12 | Resistor SMD; 10K; 603 | R16, R26, R36, R44, R45, R46, R48, R49, R50, R89, R90, R92 |
34 | 4 | Shunt; 10mR; WSL3637 | R17, R27, R37, R110 |
35 | 8 | Resistor SMD; 18R; 603 | R18, R19, R28, R29, R38, R39, R111, R112 |
36 | 3 | Resistor SMD; 4K7; 603 | R47, R51, R91 |
37 | 4 | Resistor SMD; 2K4; 603 | R52, R56, R62, R66 |
38 | 4 | Resistor SMD; 4R7; 603 | R53, R57, R63, R67 |
39 | 4 | Resistor SMD; 0,1%; 5R6; 603 | R54, R55, R64, R65 |
40 | 6 | Resistor SMD; 0,1%; 5K6; 603 | R58, R68, R114, R116, R122, R124 |
41 | 2 | Resistor SMD; 0,1%; 3K6; 603 | R59, R69 |
42 | 1 | Resistor SMD; 0,1%; 24K; 603 | R60 |
43 | 1 | Resistor SMD; 0,1%; 11K5; 603 | R61 |
44 | 3 | Resistor SMD; 1K; (not mounted); 603 | R100, R101, R102 |
45 | 4 | Resistor SMD; 56K; 805 | R113, R115, R121, R123 |
46 | 2 | Resistor SMD; 0K; (not mounted); 603 | R117, R118 |
47 | 54 | Testpoints | TP1 – TP54 |
48 | 1 | 3-Phase Bridge Driver IC; TLE9180xQKe; LQFP64-18 | U1 |
49 | 1 | 5V Power regulator; TLE42744DV50; TO252-3 | U2 |
50 | 1 | High-Slew-Rate, Single-supply 4 Operational Amplifiers; LMV344ID; SO14-150 | U3 |
51 | 1 | Dual General Purpose Operational Amplifiers, 36V, Single Supply; OPA2171A; SO8-150 | U4 |
52 | 1 | Quadruple RS-485 Diff. Line Receivers; SN65LBC175AD; SO16-150 | U5 |
53 | 1 | Single AND Gate; 74AHC1G08; SOT353 | U6 |
54 | 1 | Programmable-Gain, Voltage-Output, Bidirectional, Zero-Drift Series, Current-Shunt Monitor; INA225AIDGK; MSOP8 | U7 |
55 | 1 | Res. Phoenix Contact; MKDSN 1,5/ 6; | X1 |
56 | 1 | Hall Phoenix Contact; MKDSN 1,5/ 6; | X2 |
57 | 1 | Pin header 2x5, RM 2.54mm, with tub e.g. Multicomp series MC9A12; HDR2X5-TUB | X4 |
References
- Application Kit User Manual, revision 1.0
- AP32540 PMSM FOC motor control using AURIX™ TC3xx, revision 1.0
- User Manual AURIX™ TC3xx, revision 1.5
- Datasheet of TLE9180D-31QK, revision 1.0
- Datasheet of IPG20N04S4-08A, revision 1.0
- Datasheet of INA225, Texas Instruments
Revision history
Document version | Date of release | Description of changes |
---|---|---|
1.0 | 2020-08-17 | Initial version. |
1.1 | 2024-02-13 | Template update; no content update. |