Die temperature sensor (DTS)​

  • Continuous Measurement of the actual silicon temperature by distributed integrated sensors reflecting the actual junction temperature and variation across the die

  • Integrated Die Temperature Sensor (DTS) with an overall accuracy of measurement within ±3°C after trimming

  • Multiple DTS instances placed at proximity of hot spots to cover spatial temperature variance (dT/ds inclusive hot spots), temporal temperature variations (dT/dt) within measurement interval, and application use-case variations

  • The DTS shall generate SMU alarms when the upper or lower configurable temperature limits representing the operating temperature range of the application are violated

  • Thermal shut down alarm which can trigger a reset through the SMU (Safety Management Unit) to detect cases of thermal runaway beyond the maximum allowed junction temperature

  • Redundant temperature sensing units in different RUN and STANDBY power domains to ensure minimization of common cause faults