TRAVEO™ T2G CYT4BF series
TRAVEO™ T2G CYT4BF series MCUs comes with processing power and network connectivity built into the Arm® Cortex®-M7F dual core.
Infineon's TRAVEO™ T2G CYT3BB/ CYT4BB series MCUs offer exceptional capabilities for automotive body electronics, featuring robust processing power and reliable network connectivity built around the 2xArm®Cortex®-M7 architecture.
This series is tailored for various automotive body applications, including body control modules, HVAC 4systems, and lighting controls. The CYT2B9 series boasts a 160MHz frequency and an 2MB flash flash memory capacity.
For information about the TRAVEO™ T2G CYT4BF series portfolio, see Products.
Figure 1. Block diagram
Key features
- Up to 350 MHz main core frequency
- Up to 8 MB flash, 256 KB work flash
- 1024 KB SRAM
- 10-chxCANFD,20-chxLIN-UART,11-chSCB
- eMMC, SMIF, 10/100Ethernet, FlexRay
- I2S/TDM with TX 3ch and RX 3ch
- Up to 15-ch motor control
- 87ch,16-bit TCPWM,16ch 32-bit TCPWM
- Event generation timer
- ASIL-B support (FMEDA), eSHE&HSM
- Packages: TEQFP-176, BGA-272, -320
- Temperature: −40°C to 125°C
Key benefits
- Single/Double chip solution offering automotive functions by Arm® Cortex®-M7
- Optimized memory footprint for reduced BOM
- State-of-the-art security with Secure Boot support by a dedicated M0+ core and security hardware to accelerate cryptographic functions
- Real FOTA support based on security and dual-bank flash
- Safety (ASIL-B) features and analysis report
- Part of the TRAVEO™ T2G body MCU portfolio with a wide range of applications and a high level of software re-use
Software and tools
Infineon:
- Autosar MCAL, STL, FEE
- HSM Performance Library
Third parties that support TRAVEO™ T2G:
- IDEs:
- Green Hills Multi
- IAR Embedded Workbench
- Debug hardware:
- GHS SuperTrace Probe
- IAR I-jet, Lauterbach
Evaluation boards:
- CYTVII-B-E-BB
- CYTVII-B-H-176-SO
- CYTVII-B-H-4M-176-CPU
- CYTVII-B-H-4M-272-CPU
- CYTVII-B-H-8M-320-CPU
- CYTVII-B-H-8M-176-CPU