TRAVEO™ T2G CYT4BF series
TRAVEO™ T2G CYT4BF series MCUs comes with processing power and network connectivity built into the Arm® Cortex®-M7F dual core.
Infineon's TRAVEO™ T2G CYT3BB/ CYT4BB series MCUs offer exceptional capabilities for automotive body electronics, featuring robust processing power and reliable network connectivity built around the 2xArm® Cortex®-M7 architecture.
This series is tailored for various automotive body applications, including body control modules, HVAC 4 systems, and lighting controls. The CYT2B9 series boasts a 160 MHz frequency and an 2 MB flash flash memory capacity.
For information about the TRAVEO™ T2G CYT4BF series portfolio, see Products .
Figure 1.
Block diagram
Key features
Up to 350 MHz main core frequency
Up to 8 MB flash, 256 KB work flash
1024 KB SRAM
10-chxCANFD,20-chxLIN-UART,11-chSCB
eMMC, SMIF, 10/100Ethernet, FlexRay
I2S/TDM with TX 3ch and RX 3ch
Up to 15-ch motor control
87ch,16-bit TCPWM,16ch 32-bit TCPWM
Event generation timer
ASIL-B support (FMEDA), eSHE&HSM
Packages: TEQFP-176, BGA-272, -320
Temperature: −40°C to 125°C
Key benefits
Single/Double chip solution offering automotive functions by Arm® Cortex®-M7
Optimized memory footprint for reduced BOM
State-of-the-art security with Secure Boot support by a dedicated M0+ core and security hardware to accelerate cryptographic functions
Real FOTA support based on security and dual-bank flash
Safety (ASIL-B) features and analysis report
Part of the TRAVEO™ T2G body MCU portfolio with a wide range of applications and a high level of software re-use
Software and tools
Infineon:
Autosar MCAL, STL, FEE
Third parties that support TRAVEO™ T2G:
IDEs:
Green Hills Multi
IAR Embedded Workbench
Debug hardware:
GHS SuperTrace Probe
IAR I-jet, Lauterbach
Evaluation boards:
CYTVII-B-E-BB
CYTVII-B-H-176-SO
CYTVII-B-H-4M-176-CPU
CYTVII-B-H-4M-272-CPU
CYTVII-B-H-8M-320-CPU
CYTVII-B-H-8M-176-CPU