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TRAVEO™ T2G CYT3BB/CYT4BB series

TRAVEO™ T2G CYT3BB/4BB series MCUs comes with processing power and network connectivity built into the Arm® Cortex®-M7F single/dual core.

Infineon's TRAVEO™ T2G CYT3BB/ CYT4BB series MCUs offer exceptional capabilities for automotive body electronics, featuring robust processing power and reliable network connectivity built around the 2xArm®Cortex®-M7 architecture.

This series is tailored for various automotive body applications, including body control modules, HVAC 4systems, and lighting controls. The CYT2B9 series boasts a 160MHz frequency and an 2MB flash flash memory capacity.

Figure 1. Block diagram
Figure 1

Key features​

  • Up to 250 MHz main core frequency
  • Up to 4 MB flash, 256 KB work flash
  • 768 KB SRAM
  • 8-chxCANFD,16-chxLIN-UART,11-chxSCB
  • eMMC, SMIF, 10/100Ethernet
  • I2S/TDM with TX 3ch and RX 3ch
  • Up to 12-ch motor control
  • 63ch,16-bit TCPWM, 8ch 32-bit TCPWM
  • Event generation timer
  • ASIL-B support (FMEDA), eSHE & HSM
  • TEQFP-100, -144, -176, BGA-272
  • Temperature: −40°C to 125°C

Key benefits​

  • Single/Double chip solution offering automotive functions by Arm® Cortex®-M7
  • Optimized memory footprint for reduced BOM
  • State-of-the-art security with Secure Boot support by a dedicated M0+ core and security hardware to accelerate cryptographic functions
  • Real FOTA support based on security and dual-bank flash
  • Safety (ASIL B) features and analysis report
  • Part of the TRAVEO™ T2G body MCU portfolio with a wide range of applications and a high level of software re-use

Software and tools​

Infineon:

  • Autosar MCAL, STL, FEE
  • HSM Performance Library

Third parties that support TRAVEO™ T2G:

  • IDEs:
    • Green Hills Multi
    • IAR Embedded Workbench
  • Debug hardware:
    • GHS SuperTrace Probe
    • IAR I-jet, Lauterbach

Evaluation boards:

  • CYTVII-B-E-BB
  • CYTVII-B-H-176-SO
  • CYTVII-B-H-4M-176-CPU
  • CYTVII-B-H-4M-272-CPU
  • CYTVII-B-H-8M-320-CPU
  • CYTVII-B-H-8M-176-CPU
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