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TRAVEO™ T2G CYT3DL

Driving automotive instrument clusters and head-up displays (HUD) with a powerful 240 MHz Arm® Cortex®-M7 CPU and up to 4 MB flash.

The TRAVEO™ T2G CYT3DL series comprises microcontrollers designed exclusively for automotive applications like instrument clusters and head-up displays (HUD). With a powerful 240 MHz Arm® Cortex®-M7 CPU for main tasks, a dedicated Arm® Cortex®-M0+ CPU for peripherals and security, a 2D graphics engine, sound processing, and a WVGA GFX, the family delivers exceptional performance. It also offers two packages: a 216-pin TEQFP and a 272-ball BGA.

Introducing the TRAVEO™ T2G CYT3DL: a cutting-edge microcontroller family tailored for automotive applications like instrument clusters and heads-up displays (HUD). With its robust 240 MHz Arm® Cortex®-M7 and Arm® Cortex®-M0+ 32-bit MCU core systems, it delivers exceptional performance. Featuring 4 MB flash, 384 KB RAM, and 128 KB work flash, it supports multiple supply voltages: 1.15 V, 3.3 V, and 5.0 V.

The TRAVEO™ T2G CYT3DL family offers a wide range of interfaces, including Ethernet, 4-channel CAN FD, up to 12-channel SCB, and 2-channel LIN-UART. It also includes a 2-channel SMIF supporting various modes. Its 2.5D engine, 2 MB VRAM, and versatile video-in and video-out options enhance its cluster capabilities. The family supports audio features like sound modules, PCM-PWM, I2S, and DAC.

Packaged in 216-pin TEQFP and 272-ball BGA, the TRAVEO™ T2G CYT3DL family ensures design flexibility. It integrates seamlessly with various automotive systems through embedded peripherals and supports protocols such as CAN FD, LIN, CXPI, and Ethernet.

Experience the power of TRAVEO™ T2G CYT3DL: the ultimate choice for automotive cluster excellence.

For information about the TRAVEO™ T2G CYT3DL portfolio, see Products.

Figure 1. Block diagram

Key features​

  • 32-bit MCU core systems
    • 240-MHz Arm® Cortex®-M7 and Cortex®-M0+
    • 4MB flash, 384KB RAM, and 128KB work flash
  • 1.15 V, 3.3 V and 5.0 V supply voltages
  • Interfaces
    • Ethernet, 4-ch CAN FD, Up to 12-ch SCB, and 2-ch LIN-UART
    • 2-ch SMIF: Single/Dual/Quad/Octal-SPI/HYPERBUS™
  • Cluster features
    • 6-ch SMC + ZPD
    • 2.5D engine, 2MB VRAM, Vector drawing
    • Video-out: 2-ch (LVDS, RGB)/Video-in: 1-ch (RGB, MIPI)
    • Sound module, I2S/TDM, PCM-PWM and DAC
  • Packages
    • 216-pin TEQFP, 272-ball BGA

Key benefits​

  • Single-chip solution offering automotive functions through Arm® Cortex®-M7
  • Optimized memory footprint for reduced BOM
  • State-of-the-art security with Secure Boot support through a dedicated M0+ core and security hardware for accelerating cryptographic functions
  • Real FOTA support based on security and dual-bank flash
  • Safety (ASIL-B) features and analysis reports
  • Part of the TRAVEO™ T2G Cluster MCU portfolio for a wide range of applications and a high level of software reuse
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