TRAVEO™ T2G CYT2B9 series
Our TRAVEO™ CYT2B9 MCUs are designed for automotive body electronics with processing power and network connectivity built into the Arm™ Cortex™-M4F.
Infineon's TRAVEO™ T2G CYT2B9 MCUs ingeniously integrate powerful processing capabilities and network connectivity into Arm® Cortex®-M4F, revolutionizing automotive body electronics. Used for Body Control Modules (BCM), HVAC, and lighting, these microcontrollers ensure advanced security via HSM, Cortex®-M0+ for secure processing, and dual-bank flash for FOTA. Six power modes optimize the ECUs' energy use, complemented by top-tier security for impermeable communications. Enhanced memory and pin count flexibility further elevate adaptability.
For information about the TRAVEO™ T2G CYT2B9 series portfolio, see Products .
Figure 1.
Block diagram
Key features
Up to 160 MHz main core frequency
Up to 4 MB flash, 128 KB work flash
256 KB SRAM
Up to 8-ch CAN FD, 12-ch LIN-UART
Up to 8-ch SCB, 4-ch CXPI
Up to 12-ch motor control
63-ch 16-bit TCPWM
8-ch 32-bit TCPWM
Event generation timer
ASIL-B support (FMEDA), eSHE, HSM
LQFP-64, -80, -100, -144, -176
Temperature: −40°C to 125°C
Key benefits
Single-chip solution offering automotive functions through Arm® Cortex™-M4
Optimized memory footprint for reduced BOM
State-of-the-art security with Secure Boot support through a dedicated M0+ core and security hardware for accelerating cryptographic functions
Real FOTA support based on security and dual-bank flash
Safety (ASIL-B) features and analysis report
Part of the TRAVEO™ T2G Body MCU portfolio for a wide range of applications and a high level of software re-use
Software and tools
Infineon:
Autosar MCAL, STL, FEE
Third parties that support TRAVEO™ T2G:
IDEs:
Green Hills Multi
IAR Embedded Workbench
Debug hardware:
GHS SuperTrace Probe
IAR I-jet, Lauterbach
Evaluation boards:
CYTVII-B-E-BB
CYTVII-B-E-100-SO
CYTVII-B-E-176-SO
CYTVII-B-E-1M-176-CPU
CYTVII-B-E-2M-176-CPU