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HybridPACK Drive

HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicles traction applications offering a scalable power range of 100 kW to 250 kW within the 750 V and 1200 V class. Its design allows customers to scale performance levels, with thermal stacks and different chipsets, according to their desired cost-performance trade-off while maintaining the same module footprint.

The HybridPACK™ Drive was first introduced in 2017, using Infineon’s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. EDT2 decreased the module's chip area by 25%, improved switching performance and made it more cost-effective than infineon's preceding automotive power module, HybridPACK™ 2. The HybridPACK™ Drive is Infineon’s market-leading power module with a track record of close to three million pieces shipped for more than 20 electric vehicle platforms.

In 2021 Infineon introduced the new CoolSiC™ version, based on Infineon’s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit. Therefore, trench MOSFETs can be operated at lower gate-oxide field strengths, resulting in increased reliability.

Currently, Infineon is working on the second generation of HybridPACK™ Drive which will be available from mid of 2023. The HybridPACK™ Drive G2 will be available with different current ratings, voltage levels (750 V and 1200 V) and Infineon’s the next generation chip technologies EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET. The product will provides high ease-of-use and new features, such as an integration option for next-generation phase current sensor and on-chip temperature sensing, to enable system cost improvements.

Figure 1. HybridPACK™ Drive G1 and G2

Benefits of HybridPACK™ Drive G1 and G2​

  • Most scalable power portfolio in the market with IGBTs and CoolSiC™ in 1200/750 V for various power classes, without need for major system redesign

  • Best-in-class EDT2 and CoolSiC™ chipset with high power density and soft switching behavior for ease of design for traction inverters in EV

  • Roadmap products will continue the success: EDT3 and CoolSiC™ G2 with new benchmark performance and efficiency, targeting improved cost/performance ratio

  • Full automotive qualification AQG324

  • HybridPACK Drive application notes

Parent topic: Automotive IGBT and CoolSiC™ MOSFET modules

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