The Infineon CYW55913/55912/55911/55903/55902/55901 are a family of ultra-lower power, single-chip, connected MCUs that support 1x1 Wi-Fi 6/6E, Bluetooth® Low Energy 5.4, Matter, IP networking, targeted at Internet-of-Things (IoT) applications for stand-alone operation or to offload a host-processor. An integrated 192 MHz Arm® Cortex®-CM33, runs the Wi-Fi and Networking Stacks, Bluetooth® LE 5.4 and supports a wide array of peripherals.

The CYW5591x Wi-Fi supports single stream, 1x1, Wi-Fi 6/6E (802.11ax), with PHY rates up to 1024 QAM (MCS11) over 20-MHz channels. Included on-chip are 2.4 GHz and 5/6 GHz transmit power amplifiers (PAs), and low-noise amplifiers (LNAs) for best-in-class RF performance. The device is also capable of operating with external power amplifiers and low-noise amplifiers, as well as switched antenna diversity, if improved range is required. The CYW55913 supports tri-band (2.4 GHz, and 5/6 GHz), the CYW55912 supports dual-band (2.4 GHz and 5 GHz) and the CYW55911 supports single-band (2.4 GHz) with all devices support Bluetooth® LE 5.4.

The device supports Bluetooth® LE 5.4 with support for LE 1 Mbps, LE 2 Mbps, LE long range (Coded Phy) with advertising coding selection. The device includes on-chip power amplifiers supporting three different output power paths optimized for best efficiency, +4 dBm, +13 dBm, and +19 dBm path for driving poor antennas in wearable devices or other applications that require longer range for Bluetooth® LE. The device also features a flexible Bluetooth® receiver offering a dedicated Bluetooth® path or a Bluetooth® receive path that can be shared (sLNA) with the 2.4-GHz WLAN receive path. The CYW55903 supports tri-band (2.4 GHz, and 5/6 GHz), the CYW55902 supports dual-band (2.4 GHz and 5 GHz) and the CYW55901 supports single-band (2.4 GHz). The CYW55903/2/1 family does not support Bluetooth® LE.

The device integrates a 192 MHz Arm® Cortex® M33 processor with ThreadX RTOS, NetX Duo TCPI/IP network stack and NetX Secure for TLS 1.3 embedded in the 2048 KB of ROM. The device also embeds 768 KB of SRAM. A Quad SPI interface is available for supporting external Flash and PSRAM, supporting XIP and On-the-Fly encryption/description. Network communication can be enabled through the interface options: SDIO, gSPI, UART and SPI. The device supports three Serial Control Blocks (SCB) with each SCB supporting I2C/SPI/UART, 9x Timing Control and PWM blocks, 12-bit ADC with seven channel mux input for DC sensing. A pair of time-division multiplexing (TDM) interfaces enables a flexible interface for various audio use cases and a PDM interface is available for connecting digital microphones. A UART/SDIO/SPI/I2C/gSPI

interface is available for interfacing with the host processor. CYW55913 family does not support Bluetooth® LE Audio. See the CYW55513/2/1 for devices requiring Bluetooth® BR/EDR and Bluetooth® LE Audio support.

The CYW5591x also includes a power management unit (PMU) and requires a 37.4 MHz crystal which provides the system reference clock and can operate from an internal high-accuracy 32.768 kHz low-power oscillator (iLPO) or external 32.76 kHz crystal (eLPO) for higher accuracy or from an external reference clock. The CYW5591x includes advanced coexistence hardware mechanisms and algorithms which ensure WLAN and Bluetooth® LE simultaneous operation is optimized for maximum performance. In addition, coexistence support is available for external radios such as (LTE, GPS, and ZigBee) via an external interface. The CYW5591x operates over the -40°C to +85°C temperature range and is available in a 0.35 mm pitch WLBGA package.

Block diagram



Features

  • Connected MCU

    • Arm® Cortex®-M33 192 MHz with Trustzone Cryptocell 312

    • On-chip memory has

      • 2048-KB ROM

        • ThreadX RTOS

        • NetX Secure TLS 1.3

        • NetX Duo (TCP/IP)

      • 768-KB RAM

    • 1 x Serial memory interface (SMIF)

      • QSPI interface supporting external FLASH and PSRAM up to 16 MB

      • Option to boot from Flash, support Execute-in-place (XIP) with on-the-fly AES encryption/decryption

    • ModusToolbox™ supports various middleware, Peripheral Driver libraries, Hardware Abstraction Libraries

    • Supports interface with other Host MCUs for Network Offloads and Network communication over AT Commands interface

      • > 40 Mbps throughput with TCP/IP, TLS over SDIO

      • > 20 Mbps throughput with TCP/IP, TLS over gSPI

      • < 7.4 Mbps throughput with TCP/IP, TLS over UART

  • Wide selection of peripherals

    • 7 Channel 12-bit Sigma Delta ADC

      • 16 ksps, 7x DC sensing, 1 x analog MIC for noise threshold detection (NTD)

    • 2 x Low Power Comparators (LPCOMP)

      • Programmable thresholds for window comparison

    • 3 x Serial Communication Blocks configurable as SPI, I2C or UART

      • UART (< 7.4 Mbps)

      • I2C (100 kHz, 400 kHz and 1 MHz)

      • SPI (run up to a max clock of 24 MHz)

    • 9 x Timer Counter PWM (TCPWM)

      • 2 x 32-bit + 7 x 16-bit counters, 4 x OUT positive/negative, 8 x IN

    • 1 x PDM (Left and Right Digital microphones)

    • Audio Interfaces

      • TDM1, TDM2 each supporting inter-IC sound (I2S) (2-channels) and PCM (8-channels), 8k to 96k sample rates, and 16- and 24-bit sample widths

      • Bidirectional PCM (TDM and I2S) with 8k, 16k sample rates and 16-bit sample width. Multiplexed with TDM2 through second audio interface

      • Single-direction I2S with 48k sample rates and 16-bit sample width. Multiplexed with TDM2 through second audio interface

    • GPIO

      • 48 pins could be used for GPIO function

    • Timer/Watchdog

      • 2x Timer

      • 1x Watchdog

    • Programming and debug

      • Debug Supported via Arm® DAP JTAG/SWD

      • Programming supported via UART

  • WLAN features

    • IEEE 802.11a/b/g/n/ac/ax compliant

    • Tri-band (2.4 GHz/5 GHz/6 GHz)

    • 1x1 with 20 MHz channels supporting PHY data rates up to 802.11ax (MCS11 1024-QAM 5/6)

    • Transmit (TX) power with internal PA

      • 2.4 GHz: +24.0 dBm 1 Mbps DSSS

      • 5 GHz: +22.5 dBm 6 Mbps OFDM

      • 6 GHz:

        • +21.0 dBm MCS0 UNII-5 OFDM

        • +21.0 dBm MCS0 UNII-6 OFDM

        • +20.5 dBm MCS0 UNII-7 OFDM

        • +20.5 dBm MCS0 UNII-8 OFDM

    • Sensitivity with internal LNA

      • 2.4 GHz: -101.5 dBm 1 Mbps DSSS

      • 5 GHz: -94.5 dBm MCS0

      • 6 GHz:

        • -95.0 dBm MCS0 UNII-5

        • -95.0 dBm MCS0 UNII-6

        • -95.0 dBm MCS0 UNII-7

        • -93.5 dBm MCS0 UNII-8

    • Wi-Fi 6/6E release features

      • OFDMA up-link and down-link as STA

      • Down-link multi-user MIMO (MU-MIMO) as STA

      • Individual target-wake-time (TWT), broadcast TWT

      • BSS color

    • Support for switched antenna diversity, and external PAs and LNAs for improved range

    • Mode support:

      • STA

      • SoftAP

      • STA+Soft AP

    • Security

      • WPA2(Personal/Enterprise), WPA3 (Personal/Enterprise with 192 bit security)

  • Bluetooth® Low Energy

    • Bluetooth® 5.4 (Bluetooth® Low Energy)

      • Advertising Coding Selection

      • Encrypted Advertising Data

      • LE Generic Attribute Profile (GATT) Security Levels Characteristic

    • Bluetooth® Low Energy 5.0/5.1/5.2/5.3 features

      • Advertisement Data Information (ADI) in Periodic Advertising

      • LE Enhanced Connection Update

      • LE Channel Classification

      • LE Isochronous Channels (non-Audio applications)

      • Enhanced Attribute Protocol

      • LE Power Control

      • GATT caching

      • Periodic Advertising Sync Transfer (PAST)

      • Control Length Extension

      • Advertising Channel Index

      • Slot Availability Mask (SAM)

      • 2M PHY for LE

      • LE Coded PHY

      • High Duty Cycle Non-Connectable Advertising

      • LE Advertising Extensions

      • LE Channel Selection Algorithm #2

    • Bluetooth® LNA can be shared with WLAN LNA for reduced antenna count (sLNA)

    • Dedicated Bluetooth® LNA (dLNA) for improved RF and coexistence performance with dedicated Bluetooth® antenna

    • +4, +13, and +19 dBm Bluetooth® PA paths optimized for best efficiency, output power adjustable in 4 dB steps

    • Receive sensitivity: -111.5 dBm (Bluetooth® LE 125 kbps, LR S=8)

    • Receive sensitivity: -97.5 dBm (Bluetooth® LE 2 Mbps)

    • Bluetooth® UART with max baud rate as 4 Mbps

  • General features

    • VBAT: 3.3 V typical, 3.0 V to 4.8 V operating range

    • VDDIO: 1.8 V typical

    • 0.35 mm pitch WLBGA package

    • Temperature range: -40°C to +85°C

    • Internal 32.768 kHz low-power oscillator

      1

      ,

      2

    • External 32.768 kHz low-power oscillator (eLPO) with crystal or reference clock input for low-power consumption

      3

  • Security

    • Arm® Trustzone Cryptocell 312

    • Life cycle management

    • Crypto key establishment and management

    • Crypto offloads

    • PSA Level 2 certifiable

    • Secure boot

    • Wi-Fi, Bluetooth® and application independent firmware authentication

    • Firmware encryption

    • Attestation

    • Anti-rollback

  • Coexistence

    • Advanced coexistence 2-wire BTSIG WCI-2 (LTE) and 3-wire (ZigBee)

Potential applications

  • IP Cameras

  • Video Doorbell Cameras

  • Smart Locks

  • Smart Watches

  • IoT Gateways

  • Sensors

  • Wi-Fi Speakers

  • Thermostats

  • Appliances

  • Printers

  • Internet of Things (IoT)

  • Industrial Internet of Things (IIoT)

  • Smart Home

  • Boilers

  • Garage Door Openers (GDO)

1

Internal low-power oscillator accuracy is only adequate for WLAN, and not for Bluetooth® if low power for Bluetooth®Low-Energy required.

2

Improved HW/SW calibration schemes allows to achieve ILPO effective variation of less than 1% across PVT.

3

External LPO is needed for Bluetooth® Low Energy to support low power mode.