Description​

The Infineon Technologies AG AIROC™ CYW55513, CYW55512, and CYW55511 are a family of low-power, single-chip devices that support single-stream, tri-band, Wi-Fi 6/6E, IEEE 802.11ax-compliant Wi-Fi MAC/baseband/radio, and Bluetooth®/Bluetooth® Low Energy 6.0. In 802.11ax mode, the device supports rates up to 1024 QAM MCS11 in 20 MHz channels. The CYW55503, CYW55502, and CYW55501 are only Wi-Fi devices. All legacy rates in the 802.11a/b/g/n/ac are also supported. Included on-chip are 2.4 GHz, 5/6 GHz transmit power amplifiers (PA), and low-noise amplifiers (LNA). The device is also capable of operating with external power amplifiers and low-noise amplifiers, and antenna diversity, if an improved range is required. An SDIO v3.0 interface or gSPI are available for interfacing with the host.

The AIROC™ CYW5551x family includes a Bluetooth® subsystem that is Bluetooth® 6.0-compliant, supporting basic rate, enhanced data rate (EDR), and Bluetooth® Low Energy. The device supports Bluetooth® Low Energy 2 Mbps, Bluetooth® Low Energy 1 Mbps, long-range (LR), Low Energy Coded Phy with advertising coding selection. The device supports Bluetooth® Low Energy audio, with LC3 codec running on the device enabling typical Smart watch audio use cases. A pair of time-division multiplexing (TDM) interfaces enables a flexible interface for various audio use cases and a PDM interface is available for connecting digital microphones. The device includes on-chip power amplifiers supporting three different output power paths optimized for best efficiency; +4 dBm, +13 dBm, and +19 dBm path for driving poor antennas in wearable devices. 12-bit ADC with seven channel mux input for DC sensing. The +4dBm path only supports BDR, LE1, LE2, LELR modulation schemes. The device also features a flexible Bluetooth® receiver offering a dedicated Bluetooth® LNA (dLNA) path or a Bluetooth® receive path that can be shared (sLNA) with the 2.4 GHz WLAN receive path. A 4-wire UART or SDIO (shared with Wi-Fi) interface is available for interfacing with the host processor.

The CYW5551x family is designed to address the needs of the Internet of Things (IoT) devices that require minimal power consumption and compact size. It includes a power management unit (PMU) and requires a 37.4 MHz crystal which provides the system reference clock, and can operate from an internal 32.768 kHz low-power oscillator (iLPO) or external 32.768 kHz crystal (eLPO) for higher accuracy or from an external reference clock.

The CYW5551x family includes an advanced coexistence hardware mechanisms and algorithms which ensure WLAN and Bluetooth® simultaneous operation is optimized for maximum performance. In addition, the coexistence support is available for external radios such as (LTE, GPS, and ZigBee) via an external interface. CYW5551x family operates over the -40°C to +85°C temperature range and is available in a 0.35 mm pitch WLBGA package.

Features​

  • WLAN

    • IEEE 802.11a/b/g/n/ac/ax-compliant

    • CYW55513 and CYW55503 are tri-band (2.4/5/6 GHz) devices

    • CYW55512 and CYW55502 are dual-band (2.4/5 GHz) devices

    • CYW55511 and CYW55501 are single-band (2.4 GHz) devices

    • 1x1 with 20 MHz channels supporting PHY data rates up to 802.11ax (MCS11 1024-QAM 5/6)

    • Transmit (TX) power with internal PA

      • 2.4 GHz: +24.0 dBm 1 Mbps DSSS

      • 5 GHz: +22.5 dBm 6 Mbps OFDM

      • 6 GHz:

        • +21.0 dBm MCS0 UNII-5 OFDM

        • +21.0 dBm MCS0 UNII-6 OFDM

        • +20.5 dBm MCS0 UNII-7 OFDM

        • +20.5 dBm MCS0 UNII-8 OFDM

    • Sensitivity with internal LNA

      • 2.4 GHz: -101.5 dBm 1 Mbps DSSS

      • 5 GHz: -94.5 dBm MCS0

      • 6 GHz:

        • -95.0 dBm MCS0 UNII-5

        • -95.0 dBm MCS0 UNII-6

        • -94.5 dBm MCS0 UNII-7

        • -93.5 dBm MCS0 UNII-8

    • Wi-Fi 6 release features

      • OFDMA uplink and downlink as STA

      • Downlink multi-user MIMO (MU-MIMO) as STA

      • Individual target-wake-time (TWT), broadcast TWT

      • BSS color

    • Supports switched antenna diversity and external PAs and LNAs for an improved range

    • Interfaces

      • SDIO 2.0/3.0: up to 100 Mbps sustained throughput

      • gSPI: up to 20 Mbps sustained throughput

      • Shared SDIO between Wi-Fi and Bluetooth®

    • Modes: STA, SoftAP, Wi-Fi Direct

    • Security

      • WPA2 (Personal/Enterprise), WPA3 (Personal/Enterprise with 192-bit security)

  • CYW5551x family supports Bluetooth®/Bluetooth® Low Energy (LE)

    • Bluetooth® 6.0 (BDR + EDR + Bluetooth® Low Energy)

    • Bluetooth® 5.0/5.1/5.2/5.3/5.4/6.0 features

      • LE long range (LR)

      • LE 2 Mbps

      • LE 1 Mbps

    • Advertising

      • Coding selection

    • LE audio:

      • LE audio with LC3 codec on the device (Offload mode)

      • LE audio with LC3 codec on the host (HCI mode)

      • LE isochronous channels

      • Enhanced ISOAL

    • Bluetooth® LNA can be shared with WLAN LNA for reduced antenna count (sLNA)

    • Dedicated Bluetooth® LNA for improved RF and coexistence performance (dLNA)

    • +4, +13, and +19 dBm Bluetooth® PA paths optimized for best efficiency, output power options adjustable in 4 dB steps

    • Receive sensitivity: Bluetooth® LE 125 kbps, (LR S = 8), -111 dBm

    • Bluetooth® UART Interface (4-wire or shared SDIO with Wi-Fi)

  • Serial Communication Block (SCB)

    • The SCB supports three serial communication protocols: SPI, UART, and I2C. Only one of the protocols is supported by the SCB at any given time

  • 7 Channel 12-bit Sigma Delta ADC

    • 16 ksps, 7x DC sensing, 1x analog MIC for NTD

  • Audio interfaces

    • Hands-free profile (HFP), Advanced Audio Distribution Profile (A2DP), and LE audio

    • TDM1, TDM2, each supporting I2S (2-channels) and TDM (8-channels), 8 k to 96 k sample rates and 16-, 24-, and 32-bit sample widths

    • Bidirectional PCM (TDM and I2S) with 8 k, 16 k sample rates, and 16-bit sample width for HFP. Multiplexed with TDM2

    • Single direction I2S with 44.1 k, 48 k sample rates and 16-bit sample width for A2DP. Multiplexed with TDM2

  • General features

    • VBAT: 3.3 V typical, 3.0 V to 4.8 V operating range

    • VDDIO: 1.8 V typical

    • 0.35 mm pitch WLBGA package

    • Temperature range: -40°C to +85°C

    • Internal 32.768 kHz low-power oscillator (iLPO)

      1

      ,

      2

    • External 32.768 kHz low-power oscillator (eLPO) with crystal or reference clock input for low-power consumption

      3

    • On-chip memory includes 768 KB SRAM and 2048 KB ROM

  • Security

    • Life cycle management

    • Crypto key establishment and management

    • Crypto offloads

    • Secure boot

    • Wi-Fi and Bluetooth® independent firmware authentication

    • Firmware encryption

    • Anti-rollback

  • Applications

    • Smart watches

    • Smart glasses

    • Augmented reality/virtual reality glasses

    • IP cameras

    • Doorbells

    • Door locks

    • Sensors

    • Smart speakers

    • Smart plug

    • Smart lighting

1

Internal low-power oscillator accuracy is only adequate for WLAN, and not for Bluetooth® if low power for Bluetooth® Low-Energy required

2

Improved HW/SW calibration schemes allows to achieve ILPO effective variation of less than 1% across PVT

3

External LPO is needed for Bluetooth® Low Energy to support low power mode